脉冲电沉积制备Ni_(70)Cu_(30)合金镀层的工艺研究  

Research on preparation of Ni 70 Cu 30 alloy coating by pulsed electrodeposition

作　　者：张东[1] 李国华[1] 赵鹏[2] 浦玉萍[2] 

机构地区：[1]中国矿业大学(北京)机电与信息工程学院,北京100083 [2]钢铁研究总院粉末冶金研究室,北京100081

出　　处：《电镀与涂饰》2012年第5期10-13,共4页Electroplating & Finishing

摘　　要：采用赫尔槽试验法在柠檬酸盐体系镀液中以脉冲电沉积制备Ni-Cu合金镀层。分别采用X射线衍射仪、扫描电子显微镜及能谱仪分析了不同工艺条件下所得镀层的结构、形貌及组成,探讨了镀液中铜含量(WL)和电流密度(jk)对Ni-Cu合金镀层的铜含量(WC)及性能的影响,最终获得了WC与WL、jk之间关系的经验公式。结果表明,镀层中铜含量与镀液中铜含量呈一次线性相关,与电流密度呈幂指数关系。以经验公式为指导,综合考虑镀层外观和镀液稳定性,最终得到电沉积制备Ni70Cu30合金镀层的优化工艺参数为:WL=12%,jk=0.8A/dm2。A Ni-Cu alloy coating was prepared from citrate bath through pulsed electrodeposition by Hull cell test method. The structure, morphology, and composition of the coating were analyzed by X-ray diffraction, scanning electron microscopy, and energy-dispersive spectroscopy, respectively. The effects of Cu content in bath （WL） and current density （jk） on the Cu content of Ni-Cu alloy coating （We） were discussed and the experience equations relating Wc withjk and WL were obtained. The results showed that the copper content in coating has a linear correlation with the copper content in bath and a exponential relationship with current density. Based on the experience equations, the optimal process parameters for electrodepositing NiToCU30 alloy coating, taking the coating appearance and bath stability into consideration, were obtained as follows： WL = 12% andjk = 0.8 A/dm2.

关 键 词：镍铜合金 脉冲电沉积 电流密度 铜含量 赫尔槽试验 

分 类 号：TQ153.12[化学工程—电化学工业] TQ153.14