脉冲电镀纳米金工艺分析  

An Analysis of Pulse Nano Gold Electroplating Process

作　　者：谷城[1] 张伟风[1] 王珊[1] 

机构地区：[1]河南大学物理与电子学院,河南开封475004

出　　处：《电镀与环保》2012年第3期19-21,共3页Electroplating & Pollution Control

基　　金：河南大学校内科研基金(2009YBZR031)

摘　　要：电镀金工艺在当今半导体微纳加工领域中的应用越来越广泛,然而,传统的电镀金工艺存在许多弊端。试图从理论分析入手,寻找一种较好的脉冲电镀金工艺。重点分析了镀层厚度和金微粒大小,并通过实验对理论分析结果进行验证。实验结果表明:理论分析结果可以较好地被验证,对具体工艺有指导意义。Nowadays gold plating is widely used in the field of semiconductor micro and nano fabrication. However, the traditional gold plating process has many drawbacks. An attempt is macle to find a better pulse gold plating process starting from theoretical analysis. The focus is on the analysis of coating thickness and the size of gold grains, and the analytical results in theory are also verified by experiment. The experimental results show that the theoretical analytical results can be checked well experimentally, which has a guiding significance on specific processes.

关 键 词：脉冲电镀 理论分析 实验验证 

分 类 号：TQ153[化学工程—电化学工业]