AZ 31镁合金化学镀Ni-Cu-Sn-P前处理工艺的研究  

A Study of the Pretreatment for Electroless Ni-Cu-Sn-P Plating on AZ 31 Magnesium Alloy

作　　者：朱丹[1] 丁毅[1] 朱婧[1] 王娟[1] 马立群[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电镀与环保》2012年第3期25-27,共3页Electroplating & Pollution Control

摘　　要：通过扫描电镜(SEM)、X射线能谱仪(EDS)、结合力测试、极化曲线等手段,优选出最佳前处理工艺,并成功地在镁合金表面化学镀Ni-Cu-Sn-P四元合金。结果表明:高锰酸盐活化工艺最佳,所制得的Ni-Cu-Sn-P镀层均匀、致密,对AZ 31镁合金起到了较好的保护作用。An optimal pretreatment process was selected by means of SEM, EDS, bonding strength test, polarization curve, etc. ,and an electroless Ni-Cu-Sn-P quaternary alloy coating was successfully plated on magnesium alloy. The results show that premanganate activation process is the best. The coating thus obtained is uniform,compact,and has a good protection for AZ 31 magnesium alloy.

关 键 词：前处理 镁合金 化学镀 Ni—Cu—Sn P 

分 类 号：TQ153[化学工程—电化学工业]