智能监控器的散热仿真  

Thermal Simulation of Intelligent Monitor

作　　者：王春未[1] 张义芳[1] 王云[1] 周路[1] 

机构地区：[1]北京全路通信信号研究设计院有限公司,北京100073

出　　处：《铁路通信信号工程技术》2012年第2期60-62,共3页Railway Signalling & Communication Engineering

摘　　要：采用Ansys Icepak电子热仿真软件对智能监控器模块进行热仿真分析,比较不同结构对智能监控器模块散热的影响,大大缩短了研发周期,降低了研发成本,对提高智能监控器的热可靠性具有重要意义。The Ansys Icepak electronic thermal simulation software is used to analyze the thermal simulation of the intelligent monitor module,and compare the influence of the different structures on the cooling effect of the intelligent monitor modules.In this way,the development cycle is greatly shortened,and development cost is reduced.It is of significance for improving the intelligent monitor thermal reliability.

关 键 词：智能监控器 散热 优化 

分 类 号：TP277[自动化与计算机技术—检测技术与自动化装置]