低压脉冲磁场制备Al-4.5Cu半固态坯料的研究  被引量:5

Research of Preparation of Semi-solid Billet of Al-4.5Cu by Low-pressure Pulsed Magnetic Field

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作  者:邱辉[1] 尧军平[1] 张磊[1] 周全[1] 

机构地区:[1]南昌航空大学航空制造工程学院,江西南昌330063

出  处:《铸造技术》2012年第5期516-518,共3页Foundry Technology

基  金:国家自然科学基金资助项目(51164027);江西省国内外合作项目(2010EHB01900)

摘  要:应用低压脉冲磁场技术制备Al-4.5Cu半固态坯料,通过光学显微镜观察组织,应用ImageTool软件计算晶粒平均尺寸。结果表明,随着低压脉冲磁场放电电压的增加,树枝状晶粒生长得到抑制,晶粒逐渐被细化;当放电电压达到250 V时,晶粒最细且近似球状。同时发现,合理的模具温度对等轴状α-Al晶粒的获得也有影响;模具温度为500℃时,晶粒尺寸最小。Semi-solid billet of Al-4.5Cu was prepared by low-pressure pulsed magnetic field technology,and microstructure was observed using optical microscopy,and using of Image Tool software calculated average grain size.The results showed that the growth of dendritic grains were inhibited,and grains were gradually refined with the low-pressure pulsed magnetic field of the discharge voltage increasing.When the discharge voltage reached 250 V,the grains were the finest and approximately spherical.At the same time,obtaining equiaxed grains of α-Al were affected by the mold temperature;and When the mold temperature was 500 ℃,the size of grain was the smallest.

关 键 词:低压脉冲磁场 半固态 等轴状晶粒 

分 类 号:TG249.9[金属学及工艺—铸造]

 

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