电沉积Ni及Ni基合金的研究进展  

Recent Progress in Electrodeposition of Ni and Ni-based Alloys

作　　者：陈霜[1] 刘磊[1] 李俊[2] 黄胜标[2] 唐成龙[2] 钟澄[1] 

机构地区：[1]上海交通大学金属基复合材料国家重点实验室,上海200240 [2]宝山钢铁股份有限公司,上海201900

出　　处：《材料导报》2012年第9期110-115,共6页Materials Reports

基　　金：国家科技支撑计划课题(2011BAE13B08);国家自然科学基金(51004070);高等学校博士学科点专项科研基金(20100073120109);上海市晨光计划(11CG12)

摘　　要：主要从Ni及部分常用Ni基合金(Ni-P、Ni-W、Ni-Cr、Ni-Co等)的电沉积工艺、所得镀层组织结构及性能特点等方面,综述了不同的电沉积工艺对镀层组织结构和耐蚀性、耐磨性的影响,以及后续的处理工艺对镀层组织及性能的影响。镀液的组成、pH值及电沉积时的电流密度和温度等因素均会对电沉积的电流效率、镀层成分及组织结构造成显著影响,影响因素较为复杂,因镀液体系的不同而异。镀后热处理通常能够有效消除镀层应力,改善微观裂纹,并在一定程度上提高镀层硬度。还以Ni及其合金的电沉积机理和合金镀层的应用前景为出发点,提出了电沉积Ni基合金的未来研究方向。Electrodeposition technology, structures and properties of Ni and some typical Ni-based （such as Ni- P, Ni-W, Ni-Cr, Ni-Co） alloys are reviewed. The influence of electroplating technology and following treatment processes on the structures, corrosion resistance and abrasive resistance of these alloys＇ film are discussed. Electroplating is a complex process, in which almost all the plating elements like the component of plating solution, pH, temperature, and current density can affect the current efficiency, compositions and structures of films, and these effects differ by electroplating system. Heat treatment after electroplating is an effective way to remove film inner stress, eliminate its micro fissure and enhance its hardness. The existing problems and future trends which based on electro- plating mechanism and future application of Ni-based alloys are also discussed.

关 键 词：NI基合金 电沉积 耐磨性 耐蚀性 

分 类 号：TQ153.2[化学工程—电化学工业]