乙二醇介质中铜微粉表面化学镀银的研究  

Study on the Eletcroless Silver Plating on Copper Powders in Ethylene Glycol Medium

作　　者：李雅丽[1] 付新[1] 党蕊[1] 

机构地区：[1]渭南师范学院化学与生命科学学院,渭南714000

出　　处：《表面技术》2012年第3期60-62,共3页Surface Technology

基　　金：陕西省自然科学基金(2011JM6005)

摘　　要：在新生成的铜微粉表面化学镀银,用扫描电镜、X射线衍射仪、动态光散射粒径测试仪和热重仪对粉体进行表征和性能测试,分析了粉体导电性、抗氧化性及粒径大小和分布的影响因素。结果表明:在乙二醇介质中采用液相还原法,通过葡萄糖预还原,用甲醛进行二次还原,控制银与铜物质的量之比为2∶1,可得到抗氧化性、导电性良好的银包铜微粉。The surface of copper powers was plated with silver. The silver coated copper power was characterized and its performances were tested by XRD, DLS and TG. The influence factors of conductivity, antioxidativity and its particle size were analyzed. The results show that silver-coated copper powders are prepared by liquid chemical reduction methed, which glucose as prereductant and formaldehyde as reductant in ethylene glycol system. The mole ratio of cop per and silver is 2 ： 1. Silver-coated copper powders exhibit excellent conductivity and antioxidativity.

关 键 词：乙二醇 化学镀银 银包铜粉 导电浆料 

分 类 号：TQ153.1[化学工程—电化学工业]