Progress on Soldering Failure Analysis During the Period of Enlistment in Micro-Nanoelectronic Packaging  

作　　者：HUA Li HOU Hanna 

机构地区：[1]School of Chemistry and Life Science, Hubei University of Education, Wuhan 430205, Hubei, China [2]School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, Hubei, China

出　　处：《Wuhan University Journal of Natural Sciences》2012年第3期268-276,共9页武汉大学学报（自然科学英文版）

基　　金：Supported by the National Natural Science Foundation of China (51171068);the Vital Fund from Hubei Provincial Department of Education (C2010071);the Fund of the Vital Subject Program on Applied Chemistry in Hubei University of Education

摘　　要：With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is needed.It is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging technology.In this paper,research process and some typical failure mechanisms on interconnect solder point reliability are discussed,including electro-migration （EM）,thermal migration （TM）,K-cavity,corrosion,electrochemical migration （ECM） and whisker growth,etc.It provides the basic data for the new generation of micro/nano-packaging technique to improve the fine-pitch jointing reliability.With development of miniaturization,high integration,multifunction and high efficiency of electronic packaging technology,a higher requirement for soldering material and its enlistment property is needed.It is easily subjected to reliability failure for electronic products or components packaged with micro/nanoelectronic packaging technology.In this paper,research process and some typical failure mechanisms on interconnect solder point reliability are discussed,including electro-migration （EM）,thermal migration （TM）,K-cavity,corrosion,electrochemical migration （ECM） and whisker growth,etc.It provides the basic data for the new generation of micro/nano-packaging technique to improve the fine-pitch jointing reliability.

关 键 词：electromigration （EM） and thermal migration （TM） corrosion electrochemical migration whisker growth 

分 类 号：O646.2[理学—物理化学]