碳化硅颗粒增强铝基复合材料(SiCp/2024Al)的扩散焊研究  

DIFFUSION BONDING OF SILICON CARBIDE PARTICULATE-REINFORCED 2024 ALUMINUM COMPOSITE

作　　者：赵明久[1] 吕毓雄[1] 陈礼清[1] 毕敬[1] 

机构地区：[1]中国科学院金属研究所

出　　处：《材料研究学报》2000年第2期136-140,共5页Chinese Journal of Materials Research

基　　金：八六三计划新材料领域资助!715-005-0800

摘　　要：采用加纯铝箔中间层的方法，研究了１５％ＳｉＣｐ／２０２４Ａｌ复合材料的固态扩散焊结果表明：在温度为 ５７０℃、压力为 １６ＭＰａ、焊接时间为６０ｍｉｎ的条件下，获得了较高质量的复合材料扩散焊接头对接头进行的剪切强度试验和金相分析发现，焊接界面平行性特征不明显，中间层明显变薄的接头具有较高的剪切强度．扫描电镜观察分析显示，接头断口呈现明显的韧性断裂特征。Study on the diffusion bonding of 15%(vol.fraction)SiCp/2024AI composite in the solid state has been conducted by means of pure aluminium foil interlayer. The result showed that high quality joint has been obtained under the condition of T=570℃, P=16MPa and t=60min. The results of the shear strength test and metallographic examination showed that the joint, with parallel feature interface and interlayer obviously thinned, had higher shear strength. SEM fractographs of joint indicated that the fracture of the joint presented obviously ductile rupture.

关 键 词：铝基复合材料 碳化硅颗粒 扩散焊接 

分 类 号：TB331[一般工业技术—材料科学与工程]