含有氢键的聚酰亚胺薄膜的制备和性能表征  

Synthesis and Characterization of Hydrogen-Bonding Polyimide Films

作　　者：申晓华[1] 朱俊[1] 赵永超[1] 胡军[1] 曾科[1] 杨刚[1] 

机构地区：[1]四川大学高分子科学与工程学院,高分子材料工程国家重点实验室,四川成都610065

出　　处：《高分子材料科学与工程》2012年第5期125-128,共4页Polymer Materials Science & Engineering

基　　金：国家自然科学基金面上项目(21074077)

摘　　要：以对硝基苯甲酸为原料,通过酰氯化、酰化、还原反应成功合成了4,4’-二氨基苯酰替苯胺(DBN),DBN分别和3,3’,4,4’-联苯四酸二酐(BPDA)、均苯四甲酸二酐(PMDA)通过两步法缩聚制备出聚酰亚胺薄膜,用红外(FT-IR),差示扫描量热仪(DSC)和热重分析(TGA),拉伸测试表征其结构和性能,结果表明,成功合成了含有酰胺键的聚酰亚胺薄膜,并且酰胺键的N-H分别和酰亚胺环中的C-N和C=O形成了氢键。将其与4,4’-二氨基二苯醚(ODA)聚酰亚胺薄膜相比,对应二酐(BPDA和PMDA)分别和DBN制备的聚酰亚胺薄膜表现出了优异的热性能和耐溶剂性,尤其是拉伸强度有了显著的提高。By means of series reactions 4, 4 ＇-diaminobenzanilide （DBN） was successfully synthesized from paranitrobenzoie acid. Amide bond-containing polyimide films（ABPF） were prepared via a two-step polycondensation procedure of DBN with 3, 3＇, 4, 4 ＇-biphenyl-tetracarboxylic dianhydride and pyromellitic dianhydride. Fourier transform infrared spectrum （FT-IR）, confirmed that hydrogen band existed between H and C= O or C - N in the films. The properties of films were studied by thermogravimetric analysis （TGA）, differential scanning calorimetry （DSC） and tensile test. Compared with the polyimide films obtained from 4, 4＇-oxydianiline （ODA）, the ABPF shows excellent thermal stability, very good solvent-resistance properties and an enormous improvement of the tensile strength.

关 键 词：聚酰亚胺 薄膜 氢键 纤维 拉伸强度 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]