磨粒的“后部效应”对瓷砖破碎及振动的影响  

EXPERIMENTAL AND MICRO-IMPACT MECHANISM OF GRINDING HEAD IN POLISHING MACHINE

作　　者：邵俊鹏[1] 徐斌[1] 

机构地区：[1]哈尔滨理工大学机械动力工程学院,哈尔滨150080

出　　处：《中国陶瓷》2012年第6期36-42,共7页China Ceramics

基　　金：高等学校博士学科点专项科研基金资助项目(20050214001)

摘　　要：为了研究磨头微观加工机理,提出低、高速磨头微观冲击机理。建立微观冲击速度和振幅模型。通过SEM实验得出瓷砖微观缺陷形成过程,并验证了冲击机理理论符合瓷砖表面形貌。通过振动实验得出:粗抛阶段,低速磨头可以减少瓷砖缺陷,降低冲击振动;精抛阶段,高转速磨头可以提高瓷砖的表面质量。In order to investigate the microcosmic polishing mechanism of grinding head.Micro-impact Mechanism of low/high speed grinding head were derived.Mathematical modeling of micro-impact and amplitude is established.It is concluded that the process of forming ceramic tile defects,by a series of SEM experiments of ceramic tiles.It is concluded that the micro-impact mechanism theory agreement with ceramic tile surface topography is obtained.A series of vibration experiments of grinding head is performed,low speed grinding head can help ceramic tile defects and it can considerably reduce the impact vibration of grinding head at the rough polishing;high speed grinding head so as to effectively enhance the tile surface smoothness at the finish polishing.

关 键 词：抛光机 磨头 微观冲击 瓷砖 

分 类 号：TH17[机械工程—机械制造及自动化] TQ174.5[化学工程—陶瓷工业]