表面传导电子发射显示器件制备工艺研究  

Fabrication Technologies of Surface-Conduction Electron-Emitter Display

作　　者：刘婷[1] 周子云[1] 吴胜利[1] 胡文波[1] 

机构地区：[1]西安交通大学电子物理与器件教育部重点实验室,西安710049

出　　处：《真空科学与技术学报》2012年第5期408-412,共5页Chinese Journal of Vacuum Science and Technology

摘　　要：介绍了表面传导电子发射显示器件阴极基板和阳极基板的制备方法及其详细的真空封接工艺。所封接器件排气到高真空后,首先对其阴极基板进行了电形成工艺处理以形成纳米裂缝作为电子发射源,然后测试了器件的发光显示,得到了比较均匀的阵列发光。最后,针对发光显示图像从三个方面分别进行了分析,为整个器件性能的改进提供了很好的参考价值。We addressed the fabrication and vacuum sealing technologies of the cathode and anode for the surface conduction electron emitter display device. The cathode array were fabricated in three steps：first, the Pt films were grown by magnetron sputtering on glass substrate, followed by lithography; next, thick Ag films were deposited by screen print- ing;and finally, the conductive PdO films were coated to ease the sealing requirements. Mter sealing and degassing at 340℃ for 2 h in vacuum,the nano-scaled gaps,formed in-situ by Joule heating of the saw-tooth shaped current applied to the conductive coatings, act as the electron emission source. The tested results show that the cathode-array of the lab- made, prototyped SEM are capable of emitting a fairly uniform pattern of light.

关 键 词：表面传导电子发射显示器 阴极基板 阳极基板真空封接 

分 类 号：TN141[电子电信—物理电子学]