可用于空间的SiCp/Al复合材料热物理性能研究  

Thermal and Mechanical Properties of SiCp/Al Composite for Space Application

作　　者：修子扬[1] 刘波[1] 武高辉[1] 姜龙涛[1] 张强[1] 陈国钦[1] 

机构地区：[1]哈尔滨工业大学金属复合材料与工程研究所,哈尔滨150080

出　　处：《载人航天》2012年第3期62-64,78,共4页Manned Spaceflight

基　　金：载人航天领域预先研究项目(0902)

摘　　要：以空间应用为背景,采用挤压铸造法制备了一种体积分数为45%、粒径分别为10μm和20μm的颗粒增强金属基(SiCp/A)l复合材料,并研究了材料的弯曲强度与热物理性能。经过T6处理的颗粒粒径分别为10μm、20μm的SiCp/Al复合材料的弯曲强度分别为950MPa和780MPa;热膨胀系数分别为13.100×10-6/℃、12.300×10-6/℃;100℃时热导率分别为157.29J/(m.℃.)s、175.23J/(m.℃.)s;材料的热循环尺寸稳定性分别为8.7771×10-5、6.302×10-5。因此,SiCp/Al复合材料是一种性能优异的空间用复合材料。The particle reinforced metal composite is prepared for space application. The SiCp/Al composites with different size （10μ m, 20μm） are successfully fabricated through squeeze casting method with 45% volume fraction, and the thermal and mechanical properties of SiCp/Al composite are studied. Results show that after T6 heat treatment, the bending strength of SiCp/Al composites with particle size of 10μm and 20μm are 950 MPa and 780MPa respectively, and their average thermal of expansion coefficient are 13.100 × 10-6 /℃ and 12.300× 10-6/℃. When the temperature increases to 100℃, their thermal conductivity are 157.29 J/（m·℃ ·s） and 175.23J/（m·℃·s）,and their heat cycle dimensional stability 8.7771×10-5 and 6.302×10-5 respectively. As a result, the SiCp/Al is an excellent composite in space application.

关 键 词：SICP/AL复合材料 弯曲强度 热物理性能 空间应用 

分 类 号：V250.3[一般工业技术—材料科学与工程]