镀锡板表面黑灰形成机理的研究  

Study on the Formation Mechanism of Tinplating Smudge

作　　者：梁博[1,2] 周庚瑞[3] 唐杰[2] 潘红良[2] 

机构地区：[1]安阳工学院机械工程系,安阳455000 [2]华东理工大学机械与动力工程学院,上海200237 [3]宝山钢铁股份有限公司冷轧薄板厂,上海200431

出　　处：《复旦学报（自然科学版）》2012年第2期227-230,250,共5页Journal of Fudan University：Natural Science

摘　　要：应用扫描电子显微镜和光学显微镜观察镀锡板表面黑灰宏观形貌及显微组织形貌,应用X射线能谱仪分析黑灰的成分,应用红外光谱分析处理后黑灰的残余成分,并结合相关实验结果,得出镀锡板表面黑灰的形成机理:黑灰主要产生于电镀和软熔两段工艺及生产中的摩擦过程.电镀中由于部分锡化合价改变而形成锡的氧化物,这些氧化物以共沉积的方式进入镀层,后续软熔导致氧化物在表面浮出,同时软熔工艺也会导致锡化合价的改变,这些构成了黑灰产生的重要原因.黑灰的红外光谱分析证实了黑灰中存在聚氨酯成分,聚氨酯来自机组中的胶辊,说明黑灰的形成与胶辊表面的摩擦有关.The macro-morphology and micro-morphology of smudge were observed using scanning electron microscope（SEM） and optical microscope. The composition of smudge was analyzed with energy spectrum analysis and the infrared spectrometers was used to analyze the residuum. The results showed that smudge come from the plating and reflow processes, friction was another cause. In the plating process, Sn becomes to oxides and oxides codeposite with Sn; then, in the reflow process, oxides resend to surface. Reflow also cause oxidation. All of these factors promote smudge production. Infrared spectrometers showed that smudge contain polyurethane. Polyurethane come from rubber rolls, so smudge was related to friction.

关 键 词：电镀锡 黑灰 聚氨酯 

分 类 号：TQ150.1[化学工程—电化学工业]