基于声压传感器的电路板试验模态分析  

Test Modality Analysis of Printed Circuit Board Based on Sound Pressure Sensor

作　　者：郭建平[1] 杨洁[1] 杨明明[1] 白振岳[1] 赵亮[1] 张娅妮[1] 

机构地区：[1]中航工业西安航空计算技术研究所,西安710119

出　　处：《机械工程师》2012年第6期81-83,共3页Mechanical Engineer

摘　　要：以声压传感器作为试验模态信号采集的前端输入,对某机载计算机的印制电路板进行了试验模态分析,得出了该电路板的固有频率、振型和阻尼比。克服了传统测试方法误差较大的缺点,为机载计算机的抗振防冲设计奠定了基础。The pressure sensor acts as signal acquisition front-end input for a test modality analysis. Model analysis of an airborne computer PCB is carried out. Natural vibration frequencies, vibration modes and ratio of damping wereobtained. It has overcome many shortcomings of traditional method. It can provide reference for anti-vibration and anti-shock design of airborne computer.

关 键 词：机载计算机 电路板 固有频率 振型 试验模态 

分 类 号：TP391.7[自动化与计算机技术—计算机应用技术]