双酚B型氰酸酯的制备与性能  

Synthesis and properties of bisphenol B dicyanate ester resin

作　　者：轩立新[1] 王志强[1] 王洪玮 刘艳明[1] 

机构地区：[1]中国航空工业集团公司济南特种结构研究所,济南250023 [2]空军驻济南军事代表室,济南250023

出　　处：《北京航空航天大学学报》2012年第5期707-710,共4页Journal of Beijing University of Aeronautics and Astronautics

摘　　要：研究了碱性催化法合成非晶态双酚B型氰酸酯的制备工艺,利用红外光谱(FTIR)、核磁共振(NMR)、热分析(DSC)、流变仪等方法分析了双酚B型氰酸酯的结构性能和工艺特性,研究和测试了树脂固化物介电性能、耐热性能和力学性能.研究结果表明,制备的双酚B型氰酸酯纯度高,200℃时的凝胶时间在100 min以上;该型氰酸酯具有较低的粘度(η25℃=470 mPa.s,η40℃=210 mPa.s),适于室温树脂传递模塑(RTM,Resin Transfer Mold-ing)成型工艺;250℃固化后的介电常数为2.75,介质损耗角正切0.007(10 GHz),玻璃化转变温度299℃,弯曲强度174 MPa,模量3.2 GPa,综合性能优异.The preparation process of non-crystallized BBDCy（bisphenol B dicyanate ester resin） by alkaline catalyzer was researched.The structure and processing property of BBDCy monomer were characterized by FTIR,NMR,DSC and Rheometer.The dielectric property,heat resistance and mechanical properties of cured resin were also studied.The results show that the prepared BBDCy has high purity,and the gel time at 200 ℃ exceeds 100 min.This type of Cyanate has lower viscosity（η25℃=470 mPa·s,η40℃=210 mPa·s）,which is suitable for RTM（resin transfer molding） processing at room temperature.After cured at 250 ℃,the dielectric constant of resin is 2.75,and the dielectric loss is 0.007 at 10 GHz.The cured resin exhibits excellent comprehensive with the glass-transition temperature is 299 ℃,the flexural strength is 174 MPa and the flexural modulus is 3.2 GPa.

关 键 词：双酚B型氰酸酯 树脂传递模塑 耐热 介电性能 

分 类 号：TB332[一般工业技术—材料科学与工程]