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出 处:《Journal of Semiconductors》2012年第6期31-36,共6页半导体学报(英文版)
基 金:supported by the National Basic Research Program of China(No.2010CB934104)
摘 要:The multi-step rapid thermal annealing process of Ti/Al/Ni/Au can make good ohmic contacts with both low contact resistance and smooth surface morphology for AlGaN/GaN HEMTs.In this work,the mechanism of the multi-step annealing process is analyzed in detail by specific experimental methods.The experimental results show that annealing temperature and time are very important parameters when optimizing the Ti/Al layer for lower resistance and the Ni/Au layer for smooth surface morphology.It is very important for good ohmic contacts to balance the rate of various reactions by adjusting the annealing temperature and time.We obtained a minimum specific contact resistance of 3.22×10^(17)Ω·cm^2 on the un-doped AlGaN/GaN structure with an optimized multistep annealing process.The multi-step rapid thermal annealing process of Ti/Al/Ni/Au can make good ohmic contacts with both low contact resistance and smooth surface morphology for AlGaN/GaN HEMTs.In this work,the mechanism of the multi-step annealing process is analyzed in detail by specific experimental methods.The experimental results show that annealing temperature and time are very important parameters when optimizing the Ti/Al layer for lower resistance and the Ni/Au layer for smooth surface morphology.It is very important for good ohmic contacts to balance the rate of various reactions by adjusting the annealing temperature and time.We obtained a minimum specific contact resistance of 3.22×10^(17)Ω·cm^2 on the un-doped AlGaN/GaN structure with an optimized multistep annealing process.
关 键 词:AlGaN GaN high electron mobility transistor annealing ohmic contact
分 类 号:TN303[电子电信—物理电子学]
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