室温固化高剥离强度、耐中/低温环氧结构胶的研究  

Study on Room Temperature Curing Epoxy Structure Adhesive with High Peeling Strength and Middle-low-temperature Resistant

作　　者：姚其胜 陆企亭 

机构地区：[1]上海康达化工新材料股份有限公司,上海201201

出　　处：《上海化工》2012年第6期13-15,共3页Shanghai Chemical Industry

摘　　要：制备了一种室温固化,具有韧性的耐中/低温、高剥离强度、高剪切强度的改性环氧结构胶,并对其进行了性能测试,结果表明该环氧结构胶对多种材料具有良好的粘接性能。A modified room temperature curing epoxy structural adhesive with high peeling strength, high shear strength, middle/low temperature resistance, and toughness was prepared, and performance test was carried out. The results showed that the epoxy structural adhesive appeared good adhesion with multiple materials.

关 键 词：室温固化 剥离强度 环氧树脂 

分 类 号：TQ433.437[化学工程]