基于数字图像相关方法的粘接界面细观破坏分析  

Investigation on Adhesive Interface Failure Using Digital Image Correlation Method

作　　者：李高春[1] 刘著卿[1] 唐波[2] 王玉峰[1] 张春龙[1] 

机构地区：[1]海军航空工程学院飞行器工程系 [2]92514部队

出　　处：《宇航材料工艺》2012年第3期82-85,共4页Aerospace Materials & Technology

摘　　要：对粘接界面在拉伸过程的变形破坏过程进行了观察,对获得的图像采用数字图像相关方法进行处理,获得了界面的位移场,进而分析其变形演化过程与细观破坏机理。结果表明:数字图像相关方法可以有效地分析粘接界面中细观破坏过程,界面的细观破坏经历损伤的累积及局部化过程,最终沿某一局部化带发生宏观破坏。The failure process of adhesive interface under tensile was observed. The obtained image was analyzed by digital image correlation method. The displacement field was obtained. The deformation evolvement and microscopic failure process was analyzed. The results show that digital image correlation method can analysis the progress of failure effectively. The microscopic failure undergoes damage accumulation and localization. Consequently, the deformation concentration of localization zone and the macroeracks are occurred.

关 键 词：粘接界面 数字图像相关方法 细观破坏 

分 类 号：TU458.3[建筑科学—岩土工程]