化学镀的研究现状、应用及展望  

The Present Situation, Applications and Expectation of Electroless Plating

作　　者：陈曙光[1] 刘君武[1] 丁厚福[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《热加工工艺》2000年第2期43-45,共3页Hot Working Technology

摘　　要：化学镀作为一种优良的表面处理技术 ,几乎在所有的工业部门都得到了一定的应用。本文综述了化学镀的研究现状和几种主要化学镀层的应用领域 ,包括化学镀镍及其合金、化学镀钯等技术 ,特别叙述了化学镀铜新工艺 ,并指出了化学镀今后的研究方向。As a fine surface technology, electroless plating is applied to almost every industry branch. In this paper, the present situation of electroless plating, and the applications of several main electroless plating techniques such as Ni P, Pd are reviewed. The new technique of electroless copper plating is specially narrated, and the uptrend of the research of elctroless plating is also indicated. Key words: Electroless Plating; Present Situation;Applications;Uptrend of Researchcluding particle leaking from louver plate and particle stopping on louver plate were analyzed;and the design criteria for louver plate were established,which agree well with the experimental results.Three factors of louver plate such as its length( d 3),distance ( d 4) and angle from the horizon (θ) could be determined as followed:θ≥π2-φ i 2+φ w 2- cos -1 sin φ w sin φ i 2, d 4d 3<( tg φ i + tg θ) cos θ[HT7”SS] [WT5HZ]

关 键 词：化学镀 研究方向 表面处理 

分 类 号：TG174.44[金属学及工艺—金属表面处理]