宇航用DIP封装元器件力学环境适应性评估  

Evaluation of Dynamic Environmental Adaptability of Space-borne DIP PROM Components

作　　者：王长成 马荣国 任泽亮 范红梅 

机构地区：[1]山东航天电子技术研究所,山东烟台264003

出　　处：《电子产品可靠性与环境试验》2012年第3期11-15,共5页Electronic Product Reliability and Environmental Testing

基　　金：国家重大工程专项(2009ZX01025-001-A601)资助

摘　　要：应用力学分析和试验验证相结合的方法 ,研究了宇航用DIP封装PROM型元器件的力学环境适应能力。通过元器件力学环境敏感要素分析,确定了力学环境试验评估项目和试验量级,并设计工程样机;利用数字仿真工具进行力学分析,预示元器件的响应状态和特征,并通过对比分析而获得了传感器的合理安装方式;最后进行了评估试验,获得了相关数据,验证了传感器安装方式的合理性,给出了元器件的力学环境适应能力评估结论。实践的评估流程为后续宇航元器件力学环境适应性的研究评估提供了借鉴参考。The dynamic environmental adaptability of a space-borne DIP PROM compo- nent was investigated using the method of mechanical analysis and verification test. The me- chanical test items and test levels were determined by the component＇s dynamic environmental sen- sitive factor analysis, and the engineering prototype was designed. By the mechanical analysis us- ing simulating toolkit, the response state and characteristics of the component were predicted, and the proper installation of the accelerometer was determined. From the results of the evaluation test, the installation of the accelerometer was justified, and the component＇s dynamic environmental adaptability was eoncluded. The evaluation process praeticed provides reference for the follow-up dynamic environmental adaptability research of other spaee-borne eomponents.

关 键 词：双列直插式封装 力学环境 环境敏感要素 环境适应性 评估 

分 类 号：TN606[电子电信—电路与系统]