扩散处理对Ag-Cu复合电触头界面区域组织、成分及导电性的影响  

Effect of diffusive annealing on microstructure and composition and conductivity in interfacial region of sliver-copper composite electrical contact

作　　者：李文生[1] 李亚明[1] 杨效田[1] 王大峰[1] 刘毅[1] 张杰[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料重点实验室,甘肃兰州730050

出　　处：《兰州理工大学学报》2012年第3期9-12,共4页Journal of Lanzhou University of Technology

基　　金：甘肃省科技支撑计划(090GKCA050);中国科学院西部之光人才计划(1103-08)

摘　　要：通过等离子喷涂工艺制备Ag-Cu复合电触头试样,研究扩散退火对触头界面区域微观组织、成分分布以及导电性的影响.结果表明:400℃扩散处理使Ag-Cu复合电触头涂层在高温下产生烧结现象,涂层裂纹、孔隙减少,导电率上升;600℃扩散处理在界面区域有Cu的第二相析出,使电子散射几率下降,导电率显著上升,但随着退火时间延长,涂层内部因体积收缩,涂层裂纹、空隙增加,导电率呈现下降趋势.Samples of Ag-Cu composite electric contact were prepared with plasma spraying process and the influence of diffusive annealing on microstructure, composition and conductivity in the interfacial re- gion of this electrical contact was investigated. It was showed that the electrical conductivity of this electri- cal contact would increase if it was annealed at 400℃ resulting in less porosities and cracks in the coating due to the sintering of the coating. When it was annealed at 600℃, Cu secondary phase precipitation would take place in the interfacial region and make the probability of electronic scattering decreased and the conductivity increased remarkably. However, with the annealing time extended at 600℃, the electrical conductivity of the Ag-Cu electrical contact was tend to decrease because of the increase of the porosities and cracks due to volume contraction within the coatinm

关 键 词：Ag-Cu电接触材料 界面 扩散 显微组织 导电率 

分 类 号：TG146.4[一般工业技术—材料科学与工程]