Research on Cutting Trajectory of Electroplated Diamond Wire Saw  

作　　者：张辽远 王超 王建光 杨勇 

机构地区：[1]School of Mechanical Engineering,Shenyang Ligong University

出　　处：《Defence Technology（防务技术）》2012年第2期124-128,共5页Defence Technology

基　　金：Sponsored by Innovation team item fund of Liaoning Province ( 2008T164)

摘　　要：The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw's cutting process parameters.The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw＇ s cutting process parameters.

关 键 词：manufacturing technique and equipment electroplated diamond wire saw sawing trajectory stress analysis trajectory equation 

分 类 号：TG48[金属学及工艺—焊接]