NiW合金基带电化学抛光过程研究  

Electropolishing Process Research of NiW Alloy Substrates

作　　者：王雪[1,2] 李成山[2] 于泽铭[2] 郑会玲[2] 冀勇斌[2] 樊占国[1] 

机构地区：[1]东北大学,辽宁沈阳110004 [2]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2012年第6期1075-1079,共5页Rare Metal Materials and Engineering

基　　金：国家"863"计划(2009AA032401);陕西省自然基金(2009JM6002);中央高校基本科研业务费专项基金资助项目(N090602008)

摘　　要：采用硫酸溶液作为抛光液对轧制辅助双轴织构技术制备的Ni5W合金基带进行电化学抛光,在不同的抛光液浓度下获得了表面状态不同的基带。利用X射线光电子能谱(XPS)、X射线衍射(XRD)、扫描电镜(SEM)等手段研究了抛光过程中表面物质相成分及成因。结果表明:抛光液浓度较低时基带表面会形成过量的氧化物和H2WO4,造成表面选择性溶解过程紊乱,导致无法抛光。通过优化抛光液浓度可在基带表面获得适当厚度的固体层和粘液层,电流通过时可获得良好的抛光效果。Sulfuric acid solution was used to be the polishing slurry for the electropolishing of Ni5W alloy substrates prepared by rolling-assisted biaxially textured technology. The substrates with different surface states were obtained in several polishing slurry concentrations. The phase compositions of the surface mass and the microstructures were investigated by XPS, XRD, AFM and SEM, respectively. The results show that the low concentration polishing slurry promotes the excess production of oxides and H2WO4 which can disorder the process of selective solution disorder. The best effect can be obtained in 8.76 mol/L polishing slurry which promotes the formation of solid layer and mucus layer in proper thickness

关 键 词：硫酸 RABITS Ni5W基带 电化学抛光 

分 类 号：TG175[金属学及工艺—金属表面处理]