CuCr/1Cr18Ni9Ti双金属复合材料的真空扩散连接  

Vacuum Diffusion Bonding of CuCr/1Cr18Ni9Ti Bimetal Composite

作　　者：刘彦峰[1] 邹军涛[2] 

机构地区：[1]商洛学院化学与化学工程系,陕西商洛726000 [2]西安理工大学材料科学与工程学院,陕西西安710048

出　　处：《热加工工艺》2012年第14期125-127,共3页Hot Working Technology

基　　金：陕西省教育厅专项科研计划项目(11JK0816);商洛学院项目(10sky1002)

摘　　要：采用真空扩散连接法制备了CuCr/1Cr18Ni9Ti双金属复合材料,研究了熔铸温度对结合区组织形貌、界面反应层宽度和界面区域显微硬度的影响。结果表明,在1090℃下连接的CuCr/1Cr18Ni9Ti复合材料界面析出相颗粒的尺寸和分布最均匀,反应层也最宽,界面反应层的显微硬度呈现"凸起"趋势。CuCr/1Crl8Ni9Ti bimetal composite was prepared with vacuum diffusion bonding. The influence of melt-casting temperature on the microstructure of bonding pad, the thickness of the interfacial reaction layer and the microhardness of interface region were investigated. The results show that the dimension and distribution of the precipitated phase from the composite bonding at 1090℃ are evenest. The interracial reaction layer is also widest, and the microhardness of the interface region has a trend of bulging.

关 键 词：CUCR 1CR18NI9TI 真空扩散连接 

分 类 号：TB331[一般工业技术—材料科学与工程]