化学镀Ni-P-B合金溶液的稳定性及镀层结构的研究  

Electroless Ni-P-B Alloys Plating with Formic Acid Bath

作　　者：蒋太祥[1] 吴辉煌[1] 

机构地区：[1]固体表面物理化学国家重点实验室,厦门大学化学系361005

出　　处：《材料保护》2000年第4期1-2,4,共3页Materials Protection

摘　　要：研究了化学镀 N i-P-B合金溶液的稳定性和镀层的结构。结果表明 ,增大镀液中硫酸镍、硼氢化钠、次亚磷酸钠浓度及溶液的 p H值 ,会降低镀液的稳定性 ,而甲酸浓度增大则会显著改善镀液的稳定性。镀层中硼含量增加使磷含量下降 ,且镀层结构由非晶向微晶转变。镀层硬度随硼含量增加而增大 ,40Electroless Ni-P-B deposits with various boron content have been achieved with formic acid bath by adding both NH2PO2·H2O and NaBH4. The effects of bath operating parameters on deposition rate and bath stability have been investigated, and the properties of the deposits such as hardnees and corrosion resistance have also been studied. The results showed that the increase in HCOOH concentration could significantly increase deposition rate and bath stability, and NiSO4·6H2O and NaBH4 had insignificant effect on deposition rate. The hardness and corrosion resistance of electroless Ni-P-B alloys increased with boron content of the deposits. Annealing temperature had obvious effect on hardnees, and the peak value of hardness could be achieved after heating 1 h at 400 ℃. The corrosion resistance of Ni-P-B deposit in 40 wt% NaOH solution was better than that in 3.5% NaCl solution.

关 键 词：化学镀 镀层 结构 电镀 镀液 镍磷硼合金 镀合金 

分 类 号：TQ153.2[化学工程—电化学工业]