CO_2激光钻挠性板盲孔工艺参数的优化  

Optimized the parameters of CO_2-laser during drilling blind-vias of PCB

作　　者：胡友作[1] 何为[1] 薛卫东[1] 黄雨薪[1] 徐缓 吕文驱 罗旭 

机构地区：[1]电子科技大学微电子与固体电子学院,四川成都610054 [2]梅州博敏电子科技股份有限公司,广东梅州514000

出　　处：《印制电路信息》2012年第4期10-12,共3页Printed Circuit Information

摘　　要：选用有胶双面挠性板,通过减铜棕化工艺对板面进行处理。并运用正交试验法对影响盲孔质量的激光能量、光束直径、脉冲宽度和脉冲次数等因素进行优化,用L9(34)的正交表安排4因素3水平的试验。以盲孔真圆度和上下孔径之比作为试验指标,优化出了不同指标下的最佳参数值。并通过极差分析法得出影响盲孔质量的参数主次。通过应用被优化得到的两组参数进行再次试验后得到,当激光能量为14.2 mj,光束直径为2.2 mm,脉冲宽度为2 s时,脉冲次数为3时所得盲孔品质最优。In this paper, we handle the double flexible board through reduction Copper and brown process. And taking orthogonal experiment to optimize parameters such as laser energy, diameter of beam, pulse width and pulse shot, L9（34） orthogonal table is introduced to arrange the experiment with 4 factors and 3 levels We optimized the best parameter values by using blind-vias. Furthermore the primary and secondary factors effect n the blind-vias quality is studied by analysis of range After two experiments using sets of data have been optimized the best value of parameters have been found as laser energy is 14.2mj, beam diameter is 2.2 mm, pulse width is 2 s, pulse shot is 3.

关 键 词：CO2激光 正交试验 微盲孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]