近年酚醛纸基覆铜板技术的研究进展(1)——对近年有关酚醛纸基覆铜板日本专利内容的剖析与综述  

Development of technology about phenolic/paper copper clad laminate in recent years(1)——review and analysis of Japanese patent to phenolic/paper copper clad laminate in recent years

作　　者：祝大同[1] 

机构地区：[1]中国电子材料行业协会经济技术管理部,北京100028

出　　处：《印制电路信息》2012年第3期10-14,31,共6页Printed Circuit Information

摘　　要：对近年公开的有关酚醛-纸基覆铜板为主题的日本专利内容,在其课题背景、开发思路、所要解决的问题与手段、创新成果等方面进行剖析与综述。以此了解目前日本在酚醛纸基覆铜板技术的研究新进展。In the paper, backdrop, thought and method of Japanese open patent about phenolic/paper copper clad laminate in recent years were reviewed and analyzed. The aim is to understand the development of technology of Japanese phenolic/paper copper clad laminate recently.

关 键 词：酚醛纸基覆铜板:无卤化 桐油改性酚醛树脂 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]