分次催化法在印刷线路板上快速化学镀锡  

Quick Electroless Tin Plating on PCB by Fractionated Catalysis Mothod

作　　者：林国兴[1] 梅天庆[1] 裴玉汝[1] 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《腐蚀与防护》2012年第7期626-629,共4页Corrosion & Protection

摘　　要：以硫脲为络合剂,次磷酸钠为还原剂,六氟合钯酸钾(K2[PdF6])为催化剂,在印刷线路板(PCB)上化学镀锡。利用扫描电镜(SEM)和X射线荧光测厚仪(XRF)对镀锡层进行形貌测试和厚度分析,研究了在采用六氟合钯酸钾为催化剂进行分次催化下,不同沉积时间所获得镀锡层的表面形貌,以及在有无催化剂作用下镀锡层的沉积速度。结果表明,K2[PdF6]对化学镀锡时锡在镀锡层上的持续还原沉积具有促进作用,可以提高其沉积速度。A tin coating was deposited on printed circuit board（PCB） by electroless plating,using thiourea as complexing agent,sodium hypophosphite as reducing agent and K2 as catalytic agent.The microstructure and thickness of tin coating were investigated by means of SEM and XRF.The surface morphology of tin coating obtained from different deposition times when using K2 as catalytic agent to conduct fractionated catalysis was studied,the different depositional rates of tin coating with and without catalyst were studied too.The results show that K2 acted as catalytic agent can facilitate the continuous depositing of tin coating on PCB during electroless plating tin,and the depositional rate was improved.

关 键 词：催化剂 化学镀锡 表面形貌 厚度 

分 类 号：TQ153.1[化学工程—电化学工业]