银铜枝晶的生长及其表面增强拉曼散射  

Growth and Surface-enhanced Raman Scattering of Ag-Cu Dendrites

作　　者：牛建平[1] 陈福义[1] 张金生[1] 

机构地区：[1]西北工业大学凝固技术国家重点实验室,西安710072

出　　处：《贵金属》2012年第2期22-29,共8页Precious Metals

基　　金：国家自然科学基金(50971100;50671082);西北工业大学基础研究基金(NPU-FFR-ZC200931);凝固技术国家重点实验室自主研究课题(Grant No.30-TP-2009)

摘　　要：通过电沉积方法在铜箔上制备了泡沫铜,将该泡沫铜放入AgNO3溶液中沉积银铜枝晶。采用扫描电镜(SEM)、能谱仪(EDS)和X射线衍射仪(XRD)对枝晶形貌、元素及相组成做了分析,并研究了枝晶的表面增强拉曼散射(SERS)。研究表明:沉积电流密度和铜离子浓度都会显著影响银铜枝晶的生长,随着电流密度的增加,二次枝晶长度增加。当电流密度超过1.5 A/cm2时,电流密度的增大会抑制二次枝晶的生长;随着电解液中铜离子浓度的增加,二次枝晶长大,当铜离子浓度超过0.2 mol/L时,二次枝晶的生长会受到抑制,且发生粗化。与铜箔相比,银铜枝晶有更好的SERS效应,同一银铜枝晶薄膜不同点处的SERS强度明显不同。The Cu foam was electrodeposited on Cu foil and was used to prepare Ag - Cu dendrites in Ag- NO3 solution in this work. The morphology of Ag - Cu dendrites was characterized by scanning electron microscopy （SEM） and their elements and phases were measured by energy dispersive X - ray analysis （EDX） and X -ray diffraction （XRD）. It is noted that both the deposition current density and concen- tration of Cu2＋ influence the growth of secondary dendrites significantly. The length of the secondary den- trites increases with increasing current density, which inhibit dendritic growth Once the current density ex- ceeds 1.5 A/era2. Secondary dendrites become longer with increasing concentration of Cu2 ＋ and the ex- cessive Cu2＋ concentration inhibits the growth of secondary dendrites and induces dendrites coarsening. Compared to Cu foil, Ag - Cu dendrites exhibit a much improved surface - enhanced Raman scattering （SERS） activity and the observed SERS signals at different spots are different in the same Ag -Cu dendritic film.

关 键 词：电沉积 泡沫铜 银铜枝晶 表面增强拉曼散射 

分 类 号：TQ426.6[化学工程]