工艺参数对电解提纯铜层织构的影响  

Effects of Process Parameters on the Electrolytic Refining Copper Layer Structure

作　　者：袁菊[1] 朱承飞[2] 瞿澄[2] 姚力军[1] 

机构地区：[1]南京工业大学高技术研究院,江苏南京210009 [2]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电镀与精饰》2012年第7期1-4,共4页Plating & Finishing

摘　　要：在硫酸铜电解液中加入硫酸钠,利用电沉积和X-射线衍射方法研究了不同提纯铜工艺制备的铜镀层及织构特征。结果表明,织构度受到电流密度、镀层厚度和温度的影响,在较小的电流密度、较高温度及在较薄厚度的铜镀层得到(111)晶面择优取向,在较高的电流密度及在镀层δ达到30μm时得到(220)晶面择优取向,而且铜镀层(220)晶面比(111)晶面更易保留,(220)晶面使纯铜能获得更好的电化学性能,保持纯铜晶面的择优取向对铜在半导体的应用产生了深远的影响。Structures of the copper layer produced by different electrolytic refining techniques in sodium sulphate containing electrolyte were researched by electroplating and X-ray diffraction.Results indicated that the copper layer structures were affected by current density,deposit thickness and temperature.The preferred orientation of the copper layer produced under lower current density,higher temperature and possessing thin thickness was（111） crystal plane,while the preferred orientation of the copper layer produced under higher current density and possessing thickness extending 30 μm was（220） crystal plane which was easier to be reserved than（111） crystal plane.（220） crystal plane could make the pure copper to obtain better electrochemical capability.Maintaining the preferred orientation of the pure copper had brought a profound impact on its applications in semiconductors.

关 键 词：电解精炼 提纯铜 铜镀层 织构 

分 类 号：TQ153.14[化学工程—电化学工业]