防铜变色剂处理对引线框架与封装树脂结合力的影响  

Effect of anti-tarnishing treatment on adhesion between lead frame and epoxy molding compound

作　　者：孙江燕 倪明智[2] 于仙仙 李明[2] 

机构地区：[1]上海新阳半导体材料股份有限公司,上海201616 [2]上海交通大学,上海200240

出　　处：《电镀与涂饰》2012年第8期17-20,共4页Electroplating & Finishing

摘　　要：研究了C194铜合金引线框架表面氧化状态对封装树脂结合强度的影响。铜合金引线框架与树脂的结合强度随氧化膜厚度的增加而先增加后减小,并在厚度为100nm时达到最大值15.3MPa,比氧化前提高了2.6MPa。其原因在于氧化膜能够提高与封装树脂之间的润湿性,而氧化膜较厚时,断裂更易发生在疏松的氧化膜中,从而降低了结合强度。防铜变色剂处理可以通过有效减缓氧化膜生长来控制其结合强度。The effect of oxidation status of C194 copper lead frame on its adhesion strength with epoxy molding compound （EMC） was studied. The adhesion strength between copper alloy lead frame and EMC is increased initially and then decreased with the increasing of copper oxide film thickness. The maximum of adhesion strength is achieved as 15.3 MPa at an oxide film thickness of 100 nm, which is 2.6 MPa higher than that before oxidation. The oxide film can improve the wettability of EMC. Fracture occurs in the loose oxide film when the oxide film becomes too thick, leading to the reduction of adhesion strength. Anti-tarnishing treatment is able to retard the oxide growth and the adhesion strength is thus effectively controlled.

关 键 词：集成电路 引线框架 封装树脂 结合强度 防铜变色剂处理 

分 类 号：TQ153.14[化学工程—电化学工业]