含氮杂环二胺固化双酚F环氧胶粘剂的研究  

Study on bisphenol F epoxy adhesive using DHPZ-DA as curing agent

作　　者：王锦艳[1] 栾国栋[1] 宋蕾[1] 蹇锡高[1] 

机构地区：[1]辽宁省高性能树脂工程技术研究中心,大连理工大学化工学院高分子材料系,辽宁大连116024

出　　处：《热固性树脂》2012年第4期51-54,共4页Thermosetting Resin

摘　　要：以1,2-二氢-2-(4-氨基苯基)-4-[4-(4-氨基苯氧基)-苯基]-二氮杂萘-1-酮(DHPZ-DA)为固化剂,采用示差扫描量热法(DSC),TGA,红外光谱及剪切强度测试研究了双酚F环氧树脂/DHPZ-DA粘接体系固化行为及耐热性。由Kissinger和Ozawa方法计算得到固化体系的表观活化能分别为80.1 kJ/mol和84.3kJ/mol。由Crane方程求得的表观反应级数为0.93。该胶粘剂体系Tg>200℃,当双酚F环氧树脂与DHPZ-DA固化剂的物质的量比为10∶4时,其室温剪切强度与150℃老化24 h后的剪切强度均大于12 MPa,表现出良好的耐热性。The curing behaviors and heat resistance of bisphenol F epoxy resin/DHPZ-DA bonding system using 1,2-dihydro-2-（4-aminophenyl）-4-[4-（4-aminophenoxyl）phenyl]-phthalazin-1-one（DHPZ-DA） as curing agent were investigated by DSC,TGA,infrared spectroscopy and shear strength testsing.The curing apparent activation energy were 80.1 kJ/mol and 84.3 kJ/mol calculated by the Kissinger and Ozawa methods,respectively.The apparent reaction order obtained by the Crane equation was 0.93.The Tg of the adhesive system was higher than 200 ℃.The shear strength at room temperature and after aging at 150 ℃ for 24 h of the system with molar ratio of bisphenol F epoxy resin to DHPZ-DA 10∶ 4 were greater than 12MPa and showed good heat resistance.

关 键 词：二氮杂萘酮 双酚F环氧树脂 固化剂 胶粘剂 固化反应动力学 耐热性 剪切强度 

分 类 号：TQ433.437[化学工程]