2D-C/SiC高速深磨磨削特性及去除机制  

Investigation of grinding characteristics and removal mechanisms of 2D-C/SiC in high speed deep grinding

作　　者：刘杰[1,2] 李海滨[1] 张小彦 洪智亮[3] 何宗倍[3] 张毅[3] 刘小瀛[3] 

机构地区：[1]西北工业大学现代设计与集成制造技术教育部重点实验室,西安710072 [2]西安鑫垚陶瓷复合材料有限公司,西安710089 [3]西北工业大学超高温结构复合材料科技重点实验室,西安710072

出　　处：《复合材料学报》2012年第4期113-118,共6页Acta Materiae Compositae Sinica

基　　金：国家自然科学基金(51032006,50820145202)

摘　　要：采用树脂结合剂金刚石砂轮,通过对2D-C/SiC复合材料高速深磨磨削加工,并对磨削表面形貌和亚表面损伤进行了观察。提出了2D-C/SiC摩擦层(表面)的磨削力理论公式,讨论了磨削加工用量对磨削力和磨削力比的影响。实验结果表明,2D-C/SiC复合材料的高速深磨材料去除机制与其自身的微观结构相关,既不同于塑性材料,也不同于普通脆性材料,而是以脆性断裂去除为主。The grinding experiments were conducted on 2D-C/SiC composites by using resin bond diamond wheel in this work.The ground surface/subsurface damages were observed.The theory expression of grinding force for the friction layer（surface） of 2D-C/SiC was proposed,and the effect of grinding machining process amount on grinding force and force ratio was also discussed.The result indicates that the removal mechanisms involved in the grinding process for 2D-C/SiC composites are dominated by their brittleness fractures and related to their microstructures,which are different from those of ordinary plastic and brittle materials.

关 键 词：高速深磨 C/SIC 磨削力 磨削损伤 去除机制 

分 类 号：TB332[一般工业技术—材料科学与工程]