电镀、线路板生产过程多级串联逆流清洗工艺的应用研究  

A Research on the Application of the Multi-stage Countercurrent Cleaning Process Principle during Circuit Board Production

作　　者：余秋良 

机构地区：[1]广东省环境保护职业技术学校,广东广州510655

出　　处：《广东化工》2012年第7期61-62,66,共3页Guangdong Chemical Industry

摘　　要：文章通过对多级串联逆流清洗工艺原理,以及工艺中的清洗级数、清洗水量和清洗时间等影响因素的研究,结合某线路板企业清洁生产改造的应用进行实例分析,得到该工艺有利于电镀和线路板生产企业大幅度节水和节省成本的结论,并提出清洗级数、末级清洗槽浓度等有关参数控制的建议。The paper mainly conducted a research on the multi-stage countercurrent cleaning process principle, as well as influencing factors of the process such as its cleaning stages, cleaning water quantity and cleaning time. Combined with a case study on the application of clean production reformation by a circuit board enterprise, the paper concluded that the process was in favor of water-saving and cost-saving for circuit board manufacturers. It also proposes suggestions on relevant parameters such as the cleaning series and the concentration of final stage cleaning.

关 键 词：电镀:线路板生产:逆流清洗 

分 类 号：TQ052.4[化学工程]