丁二酸及钨酸钠对化学镀Ni-W-P镀层沉积速度的影响  

The Effect of Succinic Acid and Sodium Tungsten on Plating Rate of Electroless Ni-W-P Alloy Coating

作　　者：邢方方[1] 程延海[1] 张世举[1] 陈衡阳[1] 

机构地区：[1]中国矿业大学机电工程学院,徐州221116

出　　处：《表面技术》2012年第4期7-9,共3页Surface Technology

基　　金：国家自然科学基金资助项目(51006117);江苏高校优势学科建设工程资助项目

摘　　要：采用配方不同的化学镀液,在低碳钢基材上制备出不同的Ni-W-P三元合金镀层,对镀层沉积速度和表面形貌进行了表征。结果表明:镀液中成分的含量对镀速及镀层表面形貌都具有很大的影响,丁二酸具有十分明显的加速作用,而镀速随着钨酸钠含量的增大而减小,改变丁二酸和钨酸钠的含量可以改变镀层的表面形貌。Using electroless plating method,different ternary Ni-W-P alloy coatings were deposited on low carbon steel substrates by adjusting bath formula.The plating rate and surface morphology of different samples were characterized.The results show that the different content of reagent in the bath will have a great impact on the plating rate and the surface morphology of coating.Succinic acid has obvious accelerating action,plating rate decrease with increasing of content of sodium tungstate.The different content of succinic acid and sodium tungstate can change the surface morphology of the coating.

关 键 词：化学镀 Ni-W-P镀层 镀速 表面形貌 

分 类 号：TQ153.2[化学工程—电化学工业]