明胶对电沉积Sn-Co-C合金工艺的影响  

Effects of Gelatin on Sn-Co-C Alloy Electrodepositing Process

作　　者：陈贞干[1] 陈红辉 杨基峰[1] 黄小兵[1] 周海容 

机构地区：[1]湖南文理学院化学化工学院,湖南常德415004 [2]常德力元新材料有限责任公司,湖南常德415001

出　　处：《电镀与环保》2012年第4期21-23,共3页Electroplating & Pollution Control

摘　　要：探讨了在电沉积Sn-Co-C合金工艺体系中,明胶对三元合金工艺及镀层形态的影响。结果表明:明胶的质量浓度控制在1.0～3.0g/L时,能得到耐蚀性好且光亮平整的Sn-Co-C复合镀层;当其质量浓度低于1.0g/L时,所得镀层非常粗糙且在基体上覆盖非常不均匀;当其质量浓度高于3.0g/L时,溶液整体流动性变弱,镀层疏松,耐蚀性较差。The effects of gelatin on the ternary alloy process and coating morphology in Sn-Co-C alloy electrodepositing system were investigated.The results show that when the mass concentration of gelatin is controlled in 1.0~3.0 g/L,a bright and smooth Sn-Co-C composite coating with good corrosion resistance can be obtained;when the mass concentration is less than 1.0 g/L,the coating is very rough and very unevenly covered on the substrate;and when its mass concentration is higher than 3.0 g/L,the overall liquidity of the solution gets weaker and the coating loose,with a poorer corrosion resistance.

关 键 词：明胶 Sn-Co-C合金 电沉积 

分 类 号：TQ153[化学工程—电化学工业]