AZ31镁合金化学镀Ni-Cu-Sn-P工艺的研究  

A Study of Electroless Ni-Cu-Sn-P Plating on AZ31 Magnesium Alloy

作　　者：朱丹[1] 丁毅[1] 王娟[1] 马立群[1] 朱婧[1] 

机构地区：[1]南京工业大学材料科学与工程学院,江苏南京210009

出　　处：《电镀与环保》2012年第4期29-31,共3页Electroplating & Pollution Control

摘　　要：通过X射线衍射仪以及极化曲线等手段,优选出最佳化学镀Ni-Cu-Sn-P工艺。结果表明:在硫酸镍30g/L,硫酸铜0.4g/L,锡酸钠8g/L,次磷酸钠18g/L的条件下,所得Ni-Cu-Sn-P镀层的耐蚀性最好,且为非晶镀层。The electroless Ni-Cu-Sn-P plating process was optimized by XRD,polarization curves and so on.The results show that the best Ni-Cu-Sn-P coating was obtained when nickel sulfate is 30 g/L,cupric sulfate 0.4 g/L,sodium stannate 8 g/L,sodium hypophosphite 18 g/L.And furthermore the Ni-Cu-Sn-P coating thus obtained is amorphous.

关 键 词：镁合金 化学镀 Ni-Cu-Sn-P 耐蚀性 非晶 

分 类 号：TQ153[化学工程—电化学工业]