空心玻璃微珠无钯活化化学镀银的研究  

A Study of Electroless Silver Plating with Pd-Free Activation on Cenosphere

作　　者：朱国庆[1] 张瑾[1] 张辉[1] 

机构地区：[1]西安工程大学纺织与材料学院,陕西西安710048

出　　处：《电镀与环保》2012年第4期32-35,共4页Electroplating & Pollution Control

摘　　要：基于银镜反应原理,不经过粗化和活化直接对空心玻璃微珠进行化学镀银。采用单因素分析法,研究了硝酸银、葡萄糖、装载量、氢氧化钠和无水乙醇对银的利用率以及镀层的增重率、导电性能和结合强度等的影响,并借助扫描电镜和X射线衍射仪对镀层的表面形貌和结构进行了分析。结果表明:与胶体钯活化工艺相比,无钯活化化学镀银工艺的银的利用率高,镀层均匀、致密,导电性好,结合强度高。Based on the principle of silver mirror reaction,electroless silver plating was directly carried out on cenoshpere without pretreatments of coarsening and activation.The effects of silver nitrate,glucose,cenosphere loadage,sodium hydroxide and anhydrous alcohol on silver utilization ratio and the weight gain rate,conductivity,binding strength,etc.of the coating were investigated by single factor analysis.The surface morphology and structure of the coating were analyzed by SEM and XRD.The results indicate that as compared with colloidal palladium activation method,the silver utilization ratio is high,and the coating is uniform and compact with superior conductivity and high binding strength when the electroless silver plating process without palladium activation pretreatment is adopted.

关 键 词：空心玻璃微珠 化学镀银 性能 

分 类 号：TQ153[化学工程—电化学工业]