雷达微波盒体等温精密挤压数值模拟研究  

Numerical Simulation of Isothermal Precision Extrusion Process of Microwave Box

作　　者：朱春临[1] 许春停[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子工艺技术》2012年第4期238-241,共4页Electronics Process Technology

基　　金：国防基础科研项目(项目编号:B1120060474)

摘　　要：以雷达微波壳体为研究对象,采用刚粘塑性有限元法对其等温挤压过程进行了数值模拟,获得了成形过程中金属流动规律和应力分布状态,预测成形过程中可能存在的缺陷。在此基础上,通过数值模拟分析得到了优化的毛坯形状。通过与实验结果对比,模拟结果和实验结果一致,进一步验证数值模拟结果的可靠性与有效性。The characteristics of isothermal extrusion process for microwave box was analyzed,and the deformable process of different roughcast was analyzed by numerical simulation with rigid-plastic finite element method,the process of metal flow and stress distribution were analyzed,the defects were predicted by the simulation.In the end,through contrasts simulation and experiment,numerical simulation result is reliable;the design of roughcast and mould can be optimized by numerical simulation.

关 键 词：微波盒体 等温挤压 数值模拟 缺陷分析 

分 类 号：TN6[电子电信—电路与系统]