半导体封装模具模腔偏错位原因分析  

The Analysis of the Mismatch on the Cavity of Semiconductor Package Mold

作　　者：汪宗华 

机构地区：[1]安徽铜陵三佳山田科技有限公司,安徽铜陵244000

出　　处：《模具制造》2012年第8期71-73,共3页Die & Mould Manufacture

摘　　要：介绍了半导体封装模具偏错位种类,分析了偏错位缺陷产生的原因,并针对偏错位总结了几种相应的纠正措施、改善解决方案,指出应从模具设计、材料选择、模具温度设置调整、定位零件设计、总检与控制等各方面系统优化解决。This paper introduced the types of mismatch for the mold and analyzed the cause about this matter, at the same time, provided some corrective measures and solutions for it. Pointed out that the system solution should be pay attention to the following： mold design, material selection,mold temperature source setting adjusting, positioning parts design, inspection and control.

关 键 词：模具偏错位 材料选择 温度设置 定位零件 

分 类 号：TN305[电子电信—物理电子学]