SMP-MAX板对板射频连接器与PCB组件的整体仿真设计  

Overall Simulation Design of SMP-MAX Board-to-Board RF Connectors with PCB Assembly

作　　者：真莹 

机构地区：[1]上海雷迪埃电子有限公司,上海市200072

出　　处：《机电元件》2012年第4期5-11,共7页Electromechanical Components

摘　　要：本文描述了一套轴向和径向大容差板对板浮动连接器与PCB组件的整体仿真设计及应用方式。通过三维电磁场仿真,确定连接器内部尺寸和PCB Layout形状和尺寸,达到整体射频性能要求。This paper describes the design of whole assembly of a set of Board- to- Board floating connectors having large axial and radial misalignment with PCB and their application, and determines connector＇s internal sizes and PCB Layout shape and size by 3D electromagnetic field simulation for RF performance achievement of whole con- nector ＆ PCB assembly.

关 键 词：射频同轴连接器 PCB 组件 射频仿真 板对板 浮动 

分 类 号：TN784[电子电信—电路与系统]