热固性环氧树脂形状记忆聚合物的研究进展  

Research Progress in Thermoset Shape Memory Epoxy Resin

作　　者：魏堃[1] 朱光明[1] 唐玉生[1] 田光明[1] 谢建强[1] 

机构地区：[1]西北工业大学应用化学系,陕西西安710129

出　　处：《高分子材料科学与工程》2012年第8期183-186,共4页Polymer Materials Science & Engineering

基　　金：西北工业大学基础研究基金资助(JC201047)

摘　　要：热固性环氧树脂形状记忆聚合物是目前形状记忆聚合物研究领域的热点之一,文中介绍了热固性环氧树脂形状记忆聚合物的最新研究进展,详细探讨了各种热固性环氧树脂形状记忆聚合物的特点与性能,以及温度、辐射、固化程度对环氧树脂形状记忆聚合物性能的影响,并对环氧树脂形状记忆复合材料的性能进行了讨论,最后分析了热固性环氧树脂形状记忆聚合物研究中存在的问题。The thermoset shape memory epoxy resin was viewed as a hot issue in the field of shape memory polymers（SMP）.The latest progress of thermoset shape memory epoxy resin was reviewed and summarized.The characteristics and shape memory properties of all kinds of thermoset shape memory epoxy resin were discussed in detail in the paper.The effects of temperature,radiation and degree of curing on the shape memory properties of thermoset shape memory epoxy resin were also discussed.The mechanical and shape memory properties of thermoset shape memory epoxy based composites were systematically discussed in the paper.At last,some hot issues about themoset shape memory epoxy resin were summed up.

关 键 词：热固性环氧树脂形状记忆聚合物 复合材料 研究进展 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]