93.3Sn3.1Ag0.5Cu3.1Bi钎料熔体结构转变及其对凝固的影响  

Melt Structure Transition of 93.3Sn3.1Ag0.5Cu3.1Bi Solder and Its Effects on Solidification

作　　者：赵振兴[1] 李先芬[1] 祖方遒[1] 董野峰[1] 

机构地区：[1]合肥工业大学材料科学与工程学院,安徽合肥230009

出　　处：《金属功能材料》2012年第4期20-24,共5页Metallic Functional Materials

摘　　要：本文采用直流四电极法研究了93.3Sn3.1Ag0.5Cu3.1Bi无铅钎料合金熔体在连续两轮的升降温过程中电阻率随温度的变化关系,探讨了温度诱导的液-液结构转变;以此为基础进一步研究了该合金在结构转变前后的凝固。结果表明,93.3Sn3.1Ag0.5Cu3.1Bi合金中存在液-液结构转变,并且该结构转变在第一轮升温后的转变过程是可逆的。结合实验结果及分析可知,在首轮升温过程中,结构转变包括不可逆的和可逆的两种不同类型的结构转变。In this paper, the temperature dependence of electrical resistivity of 93.3Sn3. lag0.5Cu3.1Bi lead-free solder melts was measured at two heating and cooling cycles with the help of I）（2 four-probe method. Based on the a- bove results, further research of solidification properties of the alloy before and after structural transition was carried out. The results show the liquid-liquid structure transition （LLST） exists in 93.3Sn3. lag0.5Cu3.1Bi solder, and the structure transition is reversible after the first heating process. Combined the results of experiments and the ana- lyses, it is thought that the LLSTs in first heating process include two different types of structural transition： irre- versible and reversible.

关 键 词：93.3Sn3.1Ag0.5Cu3.1Bi无铅钎料 液-液结构转变 电阻率 短程序结构 

分 类 号：TG425[金属学及工艺—焊接]