基板组织对镀锡板锡铁合金层及其耐蚀性的影响  

Effect of Metallographic Structures of Substrate on Sn-Fe Alloy Film and Corrosion Resistance of Tinplate

作　　者：朱国和[1] 李建中[2] 邓比涛[2] 邵雄风[2] 王志成[2] 

机构地区：[1]宝山钢铁股份有限公司冷轧薄板厂,上海200431 [2]东北大学材料与冶金学院,辽宁沈阳110004

出　　处：《轧钢》2012年第4期8-10,共3页Steel Rolling

基　　金：国家自然科学基金资助项目(51004028);中央高校基本科研业务费资助项目(N100402002)

摘　　要：研究了基板金相组织对镀锡板锡铁合金层及其耐蚀性的影响。结果表明,晶界较少的镀锡基板提高了电镀过程锡的形核率,促进了晶粒细小、孔隙较少锡铁合金层的生成。BA材自腐蚀电流明显小于CA材,BA材、CA材和DR材的自腐蚀电位差别较小。3种镀锡板循环伏安曲线均出现析氧峰,BA材氧化峰电流密度最高。Effect of metallurgical structure of substrate on Sn-Fe alloy layer and corrosion resistance of tinplate were studied. The results show that the less grain boundaries of tinplate substrate improve the nucleation rate in tin plating process, the fine grain and less porosity alloy layer are obtained. Corrosion current o{ BA tinplate is significantly less than CA tinplate. Corrosion potentials of BA, CA and DR of tinplate present smaller difference. According to cyclic voltammetry curves, oxygen evolution peaks for BA, CA and DR tinplate are appearance, which of BA tinpalte is higher than that of CA and DR tinplate.

关 键 词：金相结构 镀锡板 锡铁合金层 耐蚀性 

分 类 号：TG174.4[金属学及工艺—金属表面处理]