三维电阻抗成像的测量模式  

Measurement Pattern for 3D Electrical Impedance Tomography

作　　者：王化祥[1] 黄文瑞[1] 范文茹[2] 

机构地区：[1]天津大学电气与自动化工程学院,天津300072 [2]中国民航大学航空自动化学院,天津300300

出　　处：《天津大学学报》2012年第8期729-734,共6页Journal of Tianjin University(Science and Technology)

基　　金：国家自然科学基金重大国际合作资助项目(60820106002);国家自然科学基金资助项目(50937005);中央高校基金资助项目(ZXH2011C003);天津市自然科学基金资助项目(11JCYBJC06900);天津市自然科学基金资助项目(12JCYBJC19300)

摘　　要：电阻抗成像技术(EIT)是一种非侵入的成像技术,通过测量介质的边界参数,从而获得介质的分布状态.为研究EIT的测量模式对其数据测量和图像重建的影响,借助仿真软件COMSOL建立了具有双层电极结构的EIT系统.设计和采用了4种典型的激励模式和2种测量模式,并通过评价指标进行比较.结果显示,在理想条件下,几种模式的组合表现均可.考虑到既易于测量且成像质量高,推荐双层24电极EIT系统使用同层准对向驱动模式.As a non-invasive tomographic imaging technique, ing the material distribution from a set of measured boundary electrical impedance tomography （EIT） aims at obtain- parameters. In order to study the influence of measurement pattern on measurement data and image reconstruction, a two-layer electrode EIT system was constructed by using COMSOL software, and four typical excitation pattems and two measurement patterns were designed and compared in terms of performance criteria. Simulation results demonstrate that in the ideal case, all the excitation and measurement pattems tested here perform well. To balance both measurement convenience and imaging quality, the quasi-diagonal excitation pattern with the same-layer measurement pattern is recommended for two-layer 24-electrode EIT systems.

关 键 词：电阻抗成像 三维图像重建 双层电极 激励模式 COMSOL 

分 类 号：TH701[机械工程—仪器科学与技术]