纯铜表面激光熔覆TiB_2/Cu涂层的组织及导电性能  

Microstructure and electric conductivity of laser clad TiB2/Cu coating on pure copper

作　　者：李岩[1] 张永忠[1] 黄灿[1] 宫新勇[1] 刘铭坤[1] 

机构地区：[1]北京有色金属研究总院复合材料工程中心,北京100088

出　　处：《激光技术》2012年第5期585-588,共4页Laser Technology

摘　　要：为了满足电磁导轨的使用要求,采用激光熔覆技术在纯铜表面通过预置粉的方式制备了不同成分TiB2/Cu涂层,用光学显微镜、扫描电镜和X射线衍射分析了涂层的微观结构及相组成。涂层由Cu和TiB2两相组成,当TiB2的质量分数分别为0.02,0.05和0.1时,涂层的显微硬度分别约为95HV0.1,105HV0.1和152HV0.1,电导率为22.9MS/m,20.4MS/m和16.4MS/m。涂层与基体呈良好冶金结合,无裂纹存在,TiB2颗粒存在团聚现象,熔覆层组织为外延生长的柱状晶。结果表明,随着TiB2的含量增大,涂层显微硬度升高,涂层的电导率下降。In order to meet the requirement for electromagnetic rails, through presetting powder on pure copper surface, TiB2/Cu coatings with different proportion of TiB2 were prepared by means of laser cladding. The microstructure and phases were investigated with optical microscopy, scanning electron microscopy and X-ray diffraction. The coating composed of Cu and TiB2, when the mass fraction of TiB2 is 0. 02, 0. 05 and 0. 1, the micro-hardness of the coating is approximately 95HVo. z, 105HVo. z and 152HV0.1, and the electrical conductivity is 22. 9MS/m, 20. 4MS/m and 16.4MS/m respectively. The coating metallurgically bonded with the substrate, free of cracks, and some agglomerated TiB2 particles exist. The clad layer possesses the epitaxial growth of columnar crystal. The results show that with increase of TiB2 content, the micro-hardness of TiB2/Cu coatings increases, and the conductivity decreases.

关 键 词：激光技术 电导率 激光熔覆 TiB2/Cu涂层 

分 类 号：TG156.99[金属学及工艺—热处理]