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作 者:杜小锋 宋三年 宋志棠 刘卫丽 吕士龙 顾怡峰 薛维佳 席韡
出 处:《Chinese Physics B》2012年第9期554-558,共5页中国物理B(英文版)
基 金:Project supported by the National Integrate Circuit Research Program of China (Grant No. 2009ZX02023-003);the National Key Basic Research Program of China (Grant Nos. 2010CB934300, 2011CBA00602, and 2011CB932800);the National Natural Science Foundation of China (Grant Nos. 60906003, 60906004, 61006087, and 61076121);the Science and Technology Council of Shanghai of China (Grant No. 1052nm07000)
摘 要:Phase-change line memory cells with different line widths are fabricated using focused-ion-beam deposited C-Pt as a hard mask. The electrical performance of these memory devices was characterized. The current^oltage (I-V) and resistance-voltage (RV) characteristics demonstrate that the power consumption decreases with the width of the phase-change line. A three-dimensional simulation is carried out to further study the scaling properties of the phase- change line memory. The results show that the resistive amorphous (RESET) power consumption is proportional to the cross-sectional area of the phase-change line, but increases as the line length decreases.Phase-change line memory cells with different line widths are fabricated using focused-ion-beam deposited C-Pt as a hard mask. The electrical performance of these memory devices was characterized. The current^oltage (I-V) and resistance-voltage (RV) characteristics demonstrate that the power consumption decreases with the width of the phase-change line. A three-dimensional simulation is carried out to further study the scaling properties of the phase- change line memory. The results show that the resistive amorphous (RESET) power consumption is proportional to the cross-sectional area of the phase-change line, but increases as the line length decreases.
关 键 词:phase-change memory line structure scaling properties three-dimensional simulation
分 类 号:TP333[自动化与计算机技术—计算机系统结构]
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