钨铜板材的研究现状与发展  

Research Status and Development of Tungsten-Copper Sheet Materials

作　　者：张辉[1] 陈文革[1] 

机构地区：[1]西安理工大学材料科学与工程学院,西安710048

出　　处：《材料导报》2012年第15期119-123,145,共6页Materials Reports

基　　金：陕西省教育厅自然科学基金(11JK0813)

摘　　要：针对致密度高、导热、导电性优异、热膨胀系数低的钨铜板材,就其性能要求、制备技术和研究状况进行系统全面的阐述,对比了制备高导、高强、高韧钨铜合金的各种技术,同时展望了高性能钨铜板材的发展前景。Tungsten-copper sheet materials, which is characteristic of high density, excellent electrical and thermal conductivity and lower thermal expansion coefficient, are stated systematacially based on three sides, including the performance requirements, preparation technologies and research progress. Especially, various kinds of W-Cu fabricating technologies are compared between high conductivity, strength and high ductility. Meanwhile, an outlook of W-Cu sheet is given in the development prospects.

关 键 词：钨铜合金 钨铜板材 研究现状 

分 类 号：TG141[一般工业技术—材料科学与工程]