大功率LED灯具封装结构的散热分析及优化  

Optimization and Heat Dissipation Analysis of High-power LED Lamp Package Structure

作　　者：闫云飞[1,2] 张力[1,2] 蒲舸[1,2] 张杰[2] 

机构地区：[1]重庆大学低品位能源利用技术及系统教育部重点实验室,重庆400030 [2]重庆大学动力工程学院,重庆400030

出　　处：《材料导报》2012年第16期156-160,共5页Materials Reports

基　　金：重庆市自然科学基金重点项目(CSTC,2009BA6067);重庆大学高层次人才科研启动基金(0903005104717)

摘　　要：通过对大功率LED多层材料的封装结构进行建模及数值分析,得到稳态的温度场分布、芯片最高温度与环境温度、LED功率的变化关系,并利用热阻模型对材料散热效率进行了优化。对于单一肋片,存在一个使其热阻最小的最佳肋厚。对于肋片组散热器,肋片数量较少时也能使散热器总热阻较小,且应尽量使肋片厚度接近单个肋片热阻最小时的厚度,以更少的肋片数量获得较小的散热器总热阻,这样既能控制芯片的最高温度,又可有效地节约成本。The model of high-power LED package lyzed. The steady temperature distribution, the relations with multi-materials was established and numerically ana between maximum chip temperature and environment tem perature, the relations between maximum chip temperature and LED power were obtained. The fins structure and heat dissipation efficiency of materials were optimized using thermal resistance model. An optimal thickness was gained for a single fin to achieve the lowest thermal resistance. There is a minimum of fins for fins radiator to achieve the lowest total thermal resistance. The fins thickness should be consistent with a single fin thickness, whose thermal resistance is the lowest, in order to obtain the lowest total thermal resistance using the lowest number of fins. So that the chip＇s maximum temperature and effectively decrease cost can be under control.

关 键 词：大功率LED 散热 热阻 结构优化 

分 类 号：TN305.94[电子电信—物理电子学]